YAMAHA Ultra Yüksek Hızlı Modüler YSM40R
Featurs Achieves revolutionary productivity of 200,000 CPH* giving it the world’s fastest speed on a compact platform ▶Highest productivity in the world! ▶Flexible response for different production configur
Featurs Achieves revolutionary productivity of 200,000 CPH* giving it the world’s fastest speed on a compact platform ▶Highest productivity in the world! ▶Flexible response for different production configur
Features All-purpose surface mounter with the highest speed in its class brings 1head solution evolution to a whole new level! ▶World’s fastest mounting speed in its class; 5% faster than the YSM20. ▶Featuring a
Like its predecessors, the FUJI NXT III has a variety of reconfigurable options including numerous types of positioning heads, various types of canister, pallet and belt feeders. Thanks to the possibility of a free choi
Fuji NXTIII M6III The NXT III is a highly productive, multi-functional modular placing machine. Built for speed, it features a faster XY robot and tape feeders, as well as a new H24 head that achieves 35,000 chips per h
Features Name: In-line high-speed three-dimensional solder paste inspection system Model: InSPIre-510 Type: Single rail Size: 510x505mm carrier board size; 480x490mm detection area
Feature ▶Ensuring the flexibility of handling and delivery of various components. ▶Reduced production time by optimizing Motion Sequence and sharing data between devices. ▶Through the use of three-dimensional lighting
Feature ▶SM Series is the best-selling product that has been verified by many customers around the world since its first launch in 2005. ▶Suitable for high-pixel visual method to mount IC components with high precision
X, Y, Z, üç eksenli hareket, çeşitli devre boadlarının seçici püskürtme işlemini doğru şekilde gerçekleştirerek konnektörler gibi kaplamasız alanlardan kaçınır.
FEATURES ▶Single head (single beam) capable of placing an impressive component array including: 0402mm to 120x90x28mm ▶Capable of placing large connectors, odd-shaped components, and advanced packaging types such as Po
