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Panasonic Modular Chip Mounter NPM-W2 NM-EJM7D
Panasonic Modular Chip Mounter NPM-W2 NM-EJM7D
  • Panasonic Modular Chip Mounter NPM-W2 NM-EJM7D
  • Panasonic Modular Chip Mounter NPM-W2 NM-EJM7D

Panasonic Modular Chip Mounter NPM-W2 NM-EJM7D

Feature
▶Model NM-EJM7D with 3,8,12,and 16 Light-weight Placements heads provide production flexibility.
▶Max Speed:77,000 CPH.
▶Support PCB size Max:750*550MM.
▶Support up to 120 8MM tap feeder slots.
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Panasonic Modular Chip Mounter NPM-W2 NM-EJM7D

With dual-gantry functionality
The broader capacity dual-beam NPM-W2 amplifies the NPM-W with a 10% throughput and 25% accuray improvement and integrates our award-winning Multi Recognition Camera. Combined, these features extend the component range from 03015mm microchips to 6” long connectors up to 40mm tall. Features and benefits • Combine various new light-weight version high-speed and flexible multi-function head options to handle nearly any application, including large, odd-form parts like snap-fit connectors requiring upwards of 100N placement force • Setup multiple products with 120 reels on quickchange feeder carts • Award-winning camera technology merges component alignment, chip thickness and 3D coplanarity inspection into a single pass to ensure high productivity and quality Application solutions With additional feeder capacity and a larger board size, the inherent capabilities and superior flexibility of the NPM-W2 position it as an advanced solution for any level manufacturing.

Placement heads 
An array of component placement head variations is available. With its linear motor, dual-gantry system, manufacturers can configure two heads on each machine to maximize line throughput, amplify line flexibility, or a blend for superior production versatility.
16-nozzle head ultra-high-speed chip
    42,000 CPH per head
    03015 to 6x6mm
    Up to 3mm tall
    30-micron accuracy 

12-nozzle head high-speed chip
    34,500 CPH per head
    01005 to 12x12mm
    Up to 6.5mm tall
    30-micron accuracy

8-nozzle head versatility
    21,500 CPH per head
    01005 to 32x32mm
    Up to 12mm tall
    30-micron accuracy 

3-nozzle head multi-function
    8,000 CPH per head
    0201 to 150mm long
    Up to 40mm tall
    100N placement force
 
Model ID NPM-W2
Rear head
Front head		 Lightweight
16-nozzle head		 12-nozzle head Lightweight
8-nozzle head		 3-nozzle head V2 Dispensing head No head
Lightweight 16-nozzle head NM-EJM7D NM-EJM7D-MD NM-EJM7D
12-nozzle head
Lightweight 8-nozzle head
3-nozzle head V2
Dispensing head NM-EJM7D-MD - NM-EJM7D-D
Inspection head NM-EJM7D-MA NM-EJM7D-A
No head NM-EJM7D NM-EJM7D-D -
PCB
dimensions
(mm)		 Single-lane*1 Batch
mounting		 L 50 x W 50 ~ L 750 x W 550
2-positin
mounting		 L 50 x W 50 ~ L 350 x W 550
Dual-lane*1 Dual transfer (Batch) L 50 × W 50 ~ L 750 × W 260
Dual transfer (2-positin) L 50 × W 50 ~ L 350 × W 260
Single transfer (Batch) L 50 × W 50 ~ L 750 × W 510
Single transfer (2-positin) L 50 × W 50 ~ L 350 × W 510
Electric source 3-phase AC 200, 220, 380, 400, 420, 480 V 2.8 kVA
Pneumatic source *2 0.5 MPa, 200 L /min (A.N.R.)
Dimensions *2 (mm) W 1 280*3 × D 2 332 *4 × H 1 444 *5
Mass 2 470 kg (Only for main body : This differs depending on the option configuration.)
Placement head Lightweight 16-nozzle head
(Per head)		 12-nozzle head
(Per head)		 Lightweight 8-nozzle head
(Per head)		 3-nozzle head V2
(Per head)
High production mode
[ON]		 High production mode
[OFF]		 High production mode
[ON]		 High production mode
[OFF]
Max. speed 38 500cph
(0.094 s/ chip)		 35 000cph
(0.103 s/ chip)		 32 250cph
(0.112 s/ chip)		 31 250cph
(0.115 s/ chip)		 20 800cph
(0.173 s/ chip)		 8 320cph
(0.433 s/ chip)
6 500cph
(0.554 s/ QFP)
Placement accuracy
(Cpk1)		 ±40 μm / chip ±30 μm / chip
(±25μm / chip)*6		 ±40 μm / chip ±30 μm / chip ± 30 µm/chip
± 30 µm/QFP
12mm
to 32mm
± 50 µm/QFP
12mm Under		 ± 30 µm/QFP
Component
dimensions
(mm)		 0402*7 chip ~ L 6 x W 6 x T 3 03015*7 *8/0402*7 chip ~ L 6 x W 6 x T 3 0402*7 chip ~ L 12 x W 12 x T 6.5 0402*7 chip ~ L 32 x W 32 x T 12 0603 chip to L 150 x W 25 (diagonal152) x T 30
Component
supply		 Taping Tape : 4 / 8 / 12 / 16 / 24 / 32 / 44 / 56 mm Tape : 4 to 56 mm Tape : 4 to 56 / 72 / 88 / 104 mm
Max.120 (Tape: 4, 8 mm) Front/rear feeder cart specifications : Max.120
( Tape width and feeder are subject to the conditions on the left)
Single tray specifications : Max.86
( Tape width and feeder are subject to the conditions on the left)
Twin tray specifications : Max.60
( Tape width and feeder are subject to the conditions on the left)
Stick - Front/rear feeder cart specifications :
Max.30 (Single stick feeder)
Single tray specifications :
Max.21 (Single stick feeder)
Twin tray specifications :
Max.15 (Single stick feeder)
Tray - Single tray specifications : Max.20
Twin tray specifications : Max.40
Dispensing head Dot dispensing Draw dispensing
Dispensing speed 0.16 s/dot (Condition : XY=10 mm, Z=less than 4 mm movement, No θ rotation) 4.25 s/component (Condition : 30 mm x 30 mm corner dispensing)*9
Adhesive position accuracy (Cpk1) ± 75 μ m /dot ± 100 μ m /component
Applicable components 1608 chip to SOP,PLCC,QFP, Connector, BGA, CSP BGA, CSP
Inspection head 2D inspection head (A) 2D inspection head (B)
Resolution 18 µm 9 µm
View size (mm) 44.4 x 37.2 21.1 x 17.6
Inspection
processing
time		 Solder
Inspection *10		 0.35s/ View size
Component
Inspection *10		 0.5s/ View size
Inspection
object		 Solder
Inspection *10		 Chip component : 100 μm × 150 μm or more (0603 or more)
Package component : φ150 μm or more		 Chip component : 80 μm × 120 μm or more (0402 or more)
Package component : φ120 μm or more
Component
Inspection *10		 Square chip (0603 or more), SOP, QFP (a pitch of 0.4mm or more), CSP, BGA, Aluminum electrolysis capacitor, Volume, Trimmer, Coil, Connector*11 Square chip (0402 or more), SOP, QFP (a pitch of 0.3mm or more), CSP, BGA,Aluminum electrolysis capacitor, Volume, Trimmer, Coil, Connector*11
Inspection
items		 Solder
Inspection *10		 Oozing, blur, misalignment, abnormal shape, bridging
Component
Inspection *10		 Missing, shift, flipping, polarity, foreign object inspection *12
Inspection position accuracy *13
( Cpk1)		 ± 20 μm ± 10 μm
No. of
inspection		 Solder
Inspection *10		 Max. 30 000 pcs./machine (No. of components : Max. 10 000 pcs./machine)
Component
Inspection *10		 Max. 10 000 pcs./machine
*1 : Please consult us separately should you connect it to NPM-D3/D2/D. It cannot be connected to NPM-TT and NPM.
*2 : Only for main body
*3 : 1 880 mm in width if extension conveyors (300 mm) are placed on both sides.
*4 : Dimension D including tray feeder : 2 570 mm
Dimension D including feeder cart : 2 465 mm
*5 : Excluding the monitor, signal tower and ceiling fan cover.
*6 : ±25 μm placement support option.(Under conditions specified by PSFS)
*7 : The 03015/0402 chip requires a specific nozzle/feeder.
*8 : Support for 03015 mm chip placement is optional. (Under conditions specified by PSFS:Placement accuracy ±30 μm / chip)
*9 : A PCB height measurement time of 0.5s is included.
*10 : One head cannot handle solder inspection and component inspection at the same time.
*11 : Please refer to the specification booklet for details.
*12 : Foreign object is available to chip components.(Excluding 03015 mm chip)
*13 : This is the solder inspection position accuracy measured by our reference using our glass PCB for plane calibration. It may be affected by sudden change of ambient temperature.

*Placement tact time,inspection time and accuracy values may differ slightly depending on conditions
*Please refer to the specification booklet for details.

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